29Nov, 2023
    GIGALIGHT Unveils COLOR ZR+ Quad-Carrier (4x25G NRZ) 100G QSFP28 DWDM4 Modules with O-BAND/C-BAND Options

    Shenzhen, China, November 27, 2023 – Long-distance data transmission operates through two distinct modes: coherent and non-coherent. Today, GIGALIGHT officially unveils two trailblazing 100G QSFP28 PSM DWDM4 non-coherent long-distance optical modules. These modules, built upon a 4x25G NRZ quad-carrier DWDM solution, offer options in both the C-band and O-band spectra, effectively spanning distances exceeding 80km. They aim to provide more cost-effective DWDM transmission solutions for Data Center Interconnects (DCIs) and metropolitan networks. Compared to traditional coherent solutions, this approach offers advantages such as lower pricing, lower power consumption, lower latency and easier deployment.

    Color ZR+ C-BAND 100G QSFP28 PSM DWDM4

    The GIGALIGHT Quad-Carrier Color-ZR+ C-BAND 100G QSFP28 PSM DWDM4 optical module features an MPO-12 interface on the optical side, designed with a 12-core MPO. When coupled with an external Wavelength Division Multiplexer/Demultiplexer, EDFA (Erbium-Doped Fiber Amplifier) and DCM (Dispersion Compensation Module), it achieves transmission distances of at least 80km. The product employs 4x 25G C-band 100GHz DWDM EML lasers on the transmission end and PIN detectors on the receiver end, providing 48 wavelengths. With a total power consumption of less than 5W, this module achieves a total bandwidth of 1200G under dual-fiber transmission conditions and 400G under single-fiber conditions. It seamlessly connects to 100G QSFP28 switch ports, eliminating the need for traditional DWDM optical layer equipment. Additionally, GIGALIGHT offers an all-in-one solution, including proprietary intelligent 1U optical layer equipment featuring DWDM EDFA, AAWG, and adjustable TDM or fixed DCM, providing customers with a comprehensive non-coherent DWDM transmission solution for rapid business deployment.

    1200G Transmission Solution with C-BAND 100G QSFP28 PSM DWDM4

    Color ZR+ O-BAND 100G QSFP28 PSM DWDM4

    GIGALIGHT’s quad-carrier Color ZR+ O-BAND 100G QSFP28 PSM DWDM4 optical module features an MPO interface with a 12-core configuration. When combined with an external Wavelength Division Multiplexer/Demultiplexer and SOA amplification, it achieves a transmission distance of up to 80km. The module’s transmitter employs a 25G O-BAND 150GHz DWDM DML laser, while the receiver employs a PIN detector, offering 16CH wavelengths with a power consumption of less than 5W. In a dual-fiber configuration, the module delivers a total network bandwidth of 400G. It can be directly inserted into a 100G QSFP28 switch port, eliminating the need for traditional DWDM optical layer equipment and dispersion compensation modules. Additionally, GIGALIGHT provides an all-in-one solution with its self-developed intelligent 1U optical layer equipment, including SOA amplification and a 150GHz AAWG, offering customers a complete non-coherent DWDM transmission solution for swift business deployment.

    400G Transmission Solution with O-BAND 100G QSFP28 PSM DWDM4

    GIGALIGHT is committed to advancing non-coherent DWDM transmission solutions for 100G, 200G, and 400G networks, harnessing silicon photonics and traditional technologies. This strategic focus aims to pioneer a specialized market for COLOR ZR+ non-coherent models, enabling seamless network deployment and offering customers expert-grade, cost-effective interconnection solutions in long-distance transmission segments.

    About GIGALIGHT

    As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

    23Nov, 2023
    GIGALIGHT’s Industrial Grade Triple-Proof 100G QSFP28 Hardened Modules Verified by Authoritative Reliability Testing

    SHENZHEN, China Nov. 23, 2023 – GIGALIGHT’s pioneering triple-proof 100G QSFP28 SR4/PSM4/CWDM4 hardened modules have cleared rigorous tests by the Center for Testing International (CIT), perfect for tough conditions like high temperatures, humidity, and corrosion.

    As is known, various materials such as metals, resins, and even polymer materials are susceptible to environmental changes, leading to an overall degradation in product performance. The term ‘triple-proof treatment’ refers to surface treatments applied to products to resist moisture, salt-mist, and mold, reducing or eliminating the adverse effects of harsh environments on product performance and reliability.

    As a critical component used in optical transmission or switches, optical modules primarily consist of three major parts: PCBA, metal housing, and optical components/optical engines. They are more susceptible to environmental influences in applications compared to IT equipment. The hardened modules mainly undergo explosive diagram analysis and deep triple-proof treatment targeting the overall composition of the optical modules. The PCB gold fingers adopt a unique nickel-palladium-gold process, while the PCBA and optical component sections employ overall plating and coating reinforcement processes, creating a dual protection of plating and triple-proof materials. The internal space and housing of the modules are sealed with matching sealing rings, forming a triple protection to isolate external medium erosion.

    GIGALIGHT 1G/10G hardened optical modules have been manufactured and delivered in bulk quantities for low-speed product lines. The newly launched 100G QSFP28 SR4/PSM4/CWDM4 hardened optical modules are designed to support both industrial and commercial applications. They have undergone rigorous testing, including a 95% humidity reliability test, which they have successfully passed. Additionally, they have been assessed by a domestic authority,CTI, meeting several standards: the waterproof and dustproof property test meets the IEC 60529 standard IP67 level, the anti-mold property test meets the IEC 60068-2-10 standard, a duration of 28 days overall mold-free and salt-spray proof feature complying with GR 487 standards for neutral salt spray corrosion resistance.

    GIGALIGHT 100G QSFP28 industrial grade hardened optical modules series exhibit excellent triple-proof capabilities, effectively alleviate concerns regarding the application environment and corresponding maintenance of optical module products. Particularly suitable for harsh environments (high dust, high humidity, high corrosion, etc.) and harmful environmental applications, as well as edge server application requirements.

    About GIGALIGHT

    As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

    20Nov, 2023
    Decoding QSFP-DD Module CMIS Protocol and DDM Functionality

    QSFP-DD (Quad Small Form-factor Pluggable Double Density) modules are a common standard in high-speed data communication. They feature a small size and high-density interface, supporting rapid data transmission like Ethernet and fiber channels. Communication and management between QSFP-DD modules and devices are realized through the CMIS protocol. Within the CMIS protocol, DDM plays a crucial role, offering real-time monitoring and reporting of the module’s operational status and performance. This article aims to provide a comprehensive breakdown of the CMIS protocol and DDM functionality in QSFP-DD modules.

    Overview of QSFP-DD Modules

    QSFP-DD modules are multi-channel optical modules capable of transmitting and receiving multiple optical signals simultaneously. They are predominantly utilized in high-density data centers and network equipment such as servers, switches, and routers.

    Overview of CMIS Protocol

    CMIS (Common Management Interface Specification) protocol is a communication protocol designed for managing and monitoring optical modules. It defines the interface and data format between optical modules and system management software. This enables system management software to configure, monitor, and manage optical modules through the CMIS interface. The CMIS protocol encompasses several key aspects:

    CMIS Interface: It establishes the physical connection between the optical module and system management software. QSFP-DD modules use an electronic connection method, connecting the module to the system management software through electronic interfaces.

    CMIS Data Format: CMIS defines a standardized data format and encoding mechanism for data interaction between optical modules and system management software. This format includes configuration information, operational status, performance metrics, and more.

    CMIS Commands and Responses: The protocol defines a series of commands and corresponding responses used for communication between optical modules and system management software. System management software can request specific information from optical modules by sending commands, and the modules respond accordingly.

    Overview of DDM Functionality

    DDM (Digital Diagnostics Monitoring) is a crucial feature within the CMIS protocol, responsible for real-time monitoring and reporting of an optical module’s operational status and performance. DDM monitors various parameters, including input/output optical power, temperature, voltage, among others.

    DDM Sensors and Monitoring Circuitry: Integrated within the optical module, a set of sensors and monitoring circuits track changes in multiple parameters. These components convert monitored data into digital signals, transmitting it via the CMIS interface to system management software.

    Parameter Monitoring and Reporting: Through DDM, system management software acquires real-time parameter data from the optical module, encompassing input/output optical power, temperature, voltage, etc. These metrics aid in fault detection, performance optimization, and network management.

    Applications and Advantages of DDM

    Fault Detection and Maintenance: Real-time monitoring of the optical module’s operational status and performance, such as input/output optical power, allows for swift issue identification and resolution, enhancing system reliability and stability.

    Performance Optimization and Adjustment: Monitoring changes in input/output optical power assists in understanding signal attenuation. Adjusting attenuation coefficients aids in optimizing transmission performance, elevating data transfer reliability and speed.

    Network Monitoring and Management: Integrated with network management systems, DDM enables remote monitoring and management of optical modules. Network administrators can promptly access DDM data, facilitating fault detection, performance optimization, and ultimately improving network reliability and stability.

    Limitations and Challenges of DDM Functionality

    Despite the numerous advantages of DDM functionality, several limitations and challenges exist, as outlined below:

    Data Parsing and Presentation: The data generated by DDM functionality is typically complex, requiring system management software to accurately parse and display this information. Parsing and displaying data may involve different data formats and unit conversions, necessitating corresponding functionality and algorithms within the system management software.

    Data Accuracy and Consistency: Ensuring the accuracy and consistency of DDM functionality is crucial for data reliability and comparability. Variations in optical module characteristics and manufacturing processes across different vendors may lead to inconsistencies and biases in data. This demands that system management software handle such differences to provide accurate and consistent data.

    Compatibility and Interoperability: Implementing CMIS protocols and DDM functionality requires collaboration and compatibility between vendors. Different vendors may have varying CMIS implementations for their optical modules, potentially resulting in compatibility and interoperability issues.

    The CMIS protocol and DDM functionality of QSFP-DD modules offer a standardized interface and method for managing and monitoring optical modules. Through the CMIS interface, system management software can configure, monitor, and manage optical modules. DDM functionality aids in real-time monitoring of an optical module’s operational status and performance, facilitating fault detection and performance optimization. However, it’s essential to be mindful of the limitations and challenges of DDM functionality to ensure its effective and proper utilization.

    15Nov, 2023
    Emerging Packaging Technologies: A Technical Deep Dive

    Advanced packaging stands out as a major highlight in the ‘More than Moore’ era. As chip miniaturization becomes increasingly challenging and costly at each process node, engineers are opting to place multiple chips into advanced packaging rather than struggle to further shrink the chips.

    3D packaging

    In 2.5D packaging, bare die stacks or side-by-side placements rest atop an interposer with silicon vias (TSVs). The base, or the interposer, provides connectivity between chips. In 3D IC packaging, logic die stacks together or with memory die stacks without constructing a large System on Chip (SoC). Connections between bare dies occur through an active interposer, while in 2.5D IC packaging, components are stacked on the interposer using conductive bumps or TSVs. On the other hand, 3D IC packaging connects multiple layers of silicon wafers using TSV-enabled components.

    Chiplet packaging

    A series of modular chips in a chip library can be integrated into packaging using die-to-die interconnect technology. Chiplets represent another form of 3D IC packaging, enabling the heterogeneous integration of CMOS and non-CMOS components. In essence, they are smaller System on Chips (SoCs) or chiplets rather than large SoCs in the package. Breaking down large SoCs into smaller chips boasts higher yields and lower costs compared to a single bare die. Chiplets empower designers to leverage various IPs without concern for process nodes or manufacturing technologies. They can use diverse materials, including silicon, glass, and laminates, in chip fabrication.

    Fan-out (FO) packaging

    In FO packaging, connections fan out across the chip surface, providing more external I/O. It embeds bare dies entirely in epoxy molding compound (EMC), eliminating process flows like wafer bumps, underfill, flip chips, cleaning, underfill spraying, and curing, thus bypassing the need for an interposer, simplifying heterogeneous integration. Compared to other packaging types, FO technology offers smaller packages with more I/O. In 2016, it enabled Apple to integrate TSMC’s packaging technology, housing its 16nm application processor and mobile DRAM into one package for the iPhone 7, becoming a technological standout.

    Fan-out wafer-level packaging (FOWLP)

    This technology is an enhancement of wafer-level packaging (WLP), offering more external connections for silicon chips. It embeds chips into EMC, constructs a high-density redistribution layer (RDL) on the wafer surface, and applies solder balls, forming a reconstituted wafer. Typically, treated wafers are first cut into individual bare dies, then dispersed on a carrier structure, and the gaps are filled to form a reconstituted wafer. FOWLP provides numerous connections between the package and the application circuit board, and due to the larger substrate than bare dies, the spacing between the dies is, in fact, more lenient.

    4Nov, 2023
    Why Infiniband networks are crucial in high-performance computing data centers?

    As high-data throughput applications such as data analysis and machine learning continue to expand at a rapid pace, the demand for high-bandwidth and low-latency interconnect solutions is now extending to a broader range of markets. In response to this growing need, an increasing number of high-performance computing data centers are turning to InfiniBand technology. InfiniBand is a specialized network technology designed to deliver high-speed interconnect capabilities and has gained significant traction in high-performance computing facilities worldwide.

    Today we will take an in-depth exploration of InfiniBand technology and its applications in high-performance computing data centers.

    Exploring InfiniBand Networks for High Performance Computing Data Centers

    Unlocking the Power of InfiniBand Networks for High-Performance Computing Data Centers InfiniBand technology leverages a high-performance input/output (I/O) architecture that allows for the simultaneous connection of various cable switches. With different transmission rates and physical interfaces, InfiniBand cables are typically categorized into four main types: QSFP, QSFP-DD, SFP, and AOC. These cable options provide comprehensive support for the diverse business requirements of high-performance computing data centers.

    In large-scale computing environments, InfiniBand network models utilize dedicated channels to establish connections and facilitate data transfer between mainframes and peripheral devices. InfiniBand networks boast a maximum data packet size of 4K and offer support for point-to-point and bidirectional serial links. These links can be aggregated into 4X and 12X units, delivering an impressive combined data throughput of up to 300 GB per second.

    How InfiniBand Networks Meeting the Demands of High-Performance Computing Data Centers

    Today, the internet serves as a vast infrastructure supporting a multitude of data-intensive applications. Large enterprises are constructing high-performance computing data centers to meet the demands of these applications. High-performance computing creates an exceptional system environment by establishing high-bandwidth connections between computational nodes, storage, and analytics systems. Another critical performance metric for high-performance computing architectures is low latency. Therefore, high-performance computing data centers opt for InfiniBand networks to address their requirements for high bandwidth and low latency.

    When compared to RoCE and TCP/IP, InfiniBand networks exhibit significant advantages in high-throughput processing environments, especially in scenarios utilizing server virtualization and cloud computing technologies.

    The Advantages of InfiniBand Networks in High-Performance Computing Data Centers

    The evolution of data communication technology, innovations in internet technology, and enhanced visual representations all benefit from more robust computing, increased capacity, secure storage, and efficient networks. InfiniBand networks offer a unique set of advantages that deliver higher bandwidth network services while reducing latency and minimizing the computational resource load, making them an ideal fit for high-performance computing data centers.

    1. Network Efficiency: InfiniBand networks (IB networks) offload protocol processing and data movement from the CPU to the interconnect, significantly enhancing CPU efficiency. This allows rapid processing of high-resolution simulations, large datasets, and highly parallel algorithms. In high-performance computing data centers, this results in substantial performance improvements, benefiting applications like Web 2.0, cloud computing, big data, financial services, virtualized data centers, and storage applications. It reduces task completion times and overall operational costs.

    2. InfiniBand Speed: In an era dominated by 100G Ethernet, IB network speeds continue to evolve. GIGALIGHT optical modules support advanced transmission protocols like Remote Direct Memory Access (RDMA), enhancing the efficiency of high-capacity workloads. With InfiniBand technology’s ultra-low latency, GIGALIGHT InfiniBand optical modules significantly boost the interconnectivity of high-performance computing networks and data centers.

    3. Scalability: InfiniBand allows the creation of networks with up to 48,000 nodes in a single subnet at Layer 2. Moreover, IB networks do not rely on broadcast mechanisms like ARP, preventing broadcast storms and conserving additional bandwidth.

    With these advantages of InfiniBand optical modules, they become the preferred choice for applications in data centers, high-performance computing networks, enterprise core and distribution layers, and various other scenarios.

    In Conclusion

    In a nutshell, InfiniBand networks simplify high-performance network architecture and reduce latency associated with multi-tiered structures. They provide robust support for bandwidth upgrades at critical computing nodes, helping users in high-performance computing data centers maximize their business performance. In the future, InfiniBand networks are poised to become a developing trend, widely applied across various domains to offer users robust business support.

    1Nov, 2023
    Emerging Trends in 400G and 800G: Low-Power Solutions for High-Speed Networks

    As Serdes technology drives data centers into the era of 400G and 800G, port power consumption has become a hot topic in the industry. Low-power 400G/800G interconnection solutions have been successively introduced, attracting wide attention in the industry and being widely regarded as a key technology for AI and machine learning in smart data centers.

    1. CPO Aims to Address Next-Generation Bandwidth and Power Challenges

    With the continuous acceleration of bandwidth in network and computing structures, innovation is required in system and chip architecture to mitigate the slowdown of Moore’s Law. Meanwhile, copper interconnects are rapidly reaching their bandwidth distance limits. Silicon photonics is crucial for sustaining rapid data growth and high-bandwidth applications. Co-Packaged Optics (CPO) involves co-packaging switch chip ASICs and optoelectronic engines (optical transceivers) on the same substrate, with the optical engines placed as close to the ASIC as possible to minimize high-speed electrical channel losses and impedance discontinuities. This enables the use of faster, lower-power off-chip I/O drivers. Using CPO not only achieves networking but also facilitates GPU-to-GPU interconnects, resource pooling, and memory disaggregation. It meets the requirements of AI/ML training clusters with high bandwidth and radix connections, the lowest per-bit cost, and the highest power efficiency.

    2. Linear Direct-Drive Pluggable Modules Also Reduce Power Consumption

    In the era of 400G and 800G, in addition to pluggable optical modules and CPO solutions, Linear Direct Drive (also known as linear drive) pluggable 400G/800G optical modules became a research hotspot at OFC in March of this year. The biggest advantage of this optical module solution is that it eliminates the need for DSP chips, significantly reducing the power consumption and latency of signal processing at the module level.

    GPU servers serving applications such as AI and machine learning provide excellent computing power but also result in increased server power consumption. The high-speed interconnection of 400G/800G leads to a corresponding increase in the power consumption of optical modules and network equipment. Both CPO and linear direct-drive pluggable modules may be interconnection solutions for future smart data centers, providing the lowest system-level power by eliminating all possible active components from the interconnect.