September 7, 2026, Shenzhen, China. – Two of the world’s leading optical communications industry events — the China International Optoelectronic Exposition (CIOE 2026) and the European Conference on Optical Communication (ECOC 2026) — will take place in September. As a global provider of differentiated high-speed optical interconnect solutions, GIGALIGHT will showcase its latest semi-DSP/HYBRID 1.6T silicon photonics transceiver family and HYBRID active copper cable products at both events.

Through architecture-level innovation, GIGALIGHT aims to overcome interconnect bottlenecks in AI computing clusters and provide data centers and high-performance computing (HPC) centers worldwide with next-generation optical interconnect solutions featuring low power consumption, high bandwidth, and cost efficiency.

The HYBRID product portfolio to be showcased includes:

• 1.6T OSFP-HRO 2×DR4 Silicon Photonics Transceiver
• 800G OSFP-HRO 2×DR4 Silicon Photonics Transceiver
• 800G OSFP HYBRID VR8-AOC Active Optical Cable
• 800G OSFP HYBRID PSM8-AOC Active Optical Cable

I. Addressing Industry Challenges and Rebuilding the Foundation of AI Computing Interconnects

HYBRID Architecture

As the scale of AI large-model training clusters surpasses the 100,000-GPU level, conventional pluggable optical transceiver solutions face three major challenges: high power consumption, high latency, and high cost, which have become critical bottlenecks limiting the efficiency of AI computing infrastructure.

Although LPO optical modules have attracted significant industry attention, their performance constraints have limited their deployment in practical applications.

At this year’s exhibitions, GIGALIGHT will showcase its semi-DSP/HYBRID 800G silicon photonics transceiver, featuring an innovative hybrid architecture that combines half DSP and half linear direct drive. This architecture retains the advantages of a pluggable form factor while significantly simplifying the signal-processing chain.

Compared with conventional full-DSP solutions, the HYBRID architecture can reduce overall power consumption by more than 30% and compress end-to-end latency to the sub-microsecond level. Meanwhile, the high degree of component reuse enabled by silicon photonics integration reduces overall system costs by more than 25%.

II. Three Core Advantages Redefining the 800G/1.6T Interconnect Benchmark

Low Power Consumption

Compared with conventional full-DSP 800G/1.6T silicon photonics transceivers, the HYBRID architecture reduces overall power consumption by 25%–35%.

Typical operating power can be controlled to below 12W for 800G and below 21W for 1.6T.

A single module can potentially save nearly 100 kWh of electricity per year in a data center, while a cluster deployed at a scale of tens of thousands of modules could achieve annual electricity savings reaching the million-kWh level.

High Cost Efficiency

By reducing DSP resource requirements and reusing mature silicon photonics integration technologies, the HYBRID architecture can reduce overall BOM costs by more than 20%.

Stable Transmission Performance

Leveraging the high level of integration provided by silicon photonics, the solution can achieve a pre-FEC BER at the E-8 level in 50-meter multimode transmission scenarios and a BER as low as E-9 over 500-meter single-mode fiber.

These capabilities fully meet the requirements for short- and medium-distance interconnects within and between racks in AI computing centers. The modules can be directly deployed without requiring additional hardware tuning of existing switches or network interface cards (NICs).

III. Joint Presence at CIOE and ECOC: Demonstrating the Feasibility and Reliability of Semi-DSP Copper and Optical Interconnects

To demonstrate the practical value of its HYBRID architecture, GIGALIGHT’s technical team will conduct demonstrations using its self-developed CHECKER loopback testing system, together with on-site validation using NVIDIA switches.

The demonstrations will provide global cloud service providers and industry partners with an in-depth explanation of the technical specifications and implementation of the semi-DSP architecture, helping accelerate the integration of this innovative solution into the global AI computing infrastructure supply chain.

“As AI computing infrastructure enters a sustained period of strong growth, GIGALIGHT’s global showcase of its semi-DSP/HYBRID product portfolio — particularly the global debut of its 1.6T HYBRID silicon photonics transceiver — will introduce a new architectural approach to the global optical communications industry. It will help accelerate the evolution of AI computing interconnects toward a better balance among power consumption, latency, and performance,” said a GIGALIGHT technical representative.

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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— Focusing on SCALE UP and SCALE ACROSS to Showcase Next-Generation Optical Interconnect Technologies for AI Computing

August 28, 2026, Shenzhen, China. – From September 2 to 4, 2026, the 2026 Open Data Center Conference & First China Computing Expo (2026 ODX) will be held at the National Convention Center Phase II in Beijing. GIGALIGHT will showcase its 1.6T DR16 NPO linear silicon photonics engine and dual-approach 400G QSFP-DD DWDM solutions at Booth A62, demonstrating high-speed, low-power, and cost-effective optical interconnect solutions for AI computing networks.

As AI computing clusters continue to scale rapidly, data center interconnects (DCI) face increasingly demanding requirements for bandwidth, transmission distance, latency, power consumption, and cost. To address different computing interconnect scenarios, GIGALIGHT continues to develop solutions around SCALE UP and SCALE ACROSS, building a multi-level optical interconnect portfolio ranging from 1.6T NPO silicon photonics engines to 400G DWDM solutions.

1.6T NPO Silicon Photonics Engine: High-Speed Interconnect for SCALE UP

The XT-1.6T DR16 NPO Linear Silicon Photonics Engine featured at the event adopts a socket-based package with dimensions compliant with the OIF Co-Packaging-3.2T-Module-01.0 specification, integrating LPO linear direct-drive and flip-chip bonding technologies.

The product features a 16 × 100G PAM4 architecture, supports transmission distances of up to 500 m, and consumes less than 11 W. By eliminating the DSP, it further reduces system power consumption, cost, and processing latency, making it suitable for next-generation 1.6T/3.2T SCALE UP computing interconnects.

The accompanying EL-OSFP external light source module features front-facing optical ports and supports 8-channel CWL high-power light sources, providing optical source support for high-density silicon photonics interconnects.

Dual-Approach 400G QSFP-DD DWDM: Addressing Different DCI Distance Requirements

For SCALE ACROSS computing interconnects and data center interconnect (DCI) applications, GIGALIGHT will highlight two 400G QSFP-DD DWDM technology approaches:

400G QSFP-DD DCO ZR+ Coherent DWDM Solution

Based on coherent optical communication technology, this solution is designed for longer-distance DCI transmission over 80–120 km. It provides a high-performance solution for high-capacity, long-distance optical interconnects, meeting the requirements for high-speed connectivity between different data centers and computing centers.

400G QSFP-DD O-BAND Non-Coherent DWDM Solution

Based on O-BAND (1310 nm) non-coherent DWDM technology, this solution takes advantage of the near-zero chromatic dispersion characteristics of the O-BAND, eliminating the need for conventional dispersion compensation modules (DCMs).

It is particularly suitable for 10 km-class medium- and short-distance DCI applications. By using O-BAND MUX technology, the solution enables an aggregate transmission bandwidth of 1.6T. Compared with complex coherent architectures, it can further reduce system complexity while delivering low latency, low power consumption, and low cost.

The two 400G QSFP-DD DWDM approaches are complementary, providing flexible options for different DCI scenarios based on transmission distance, network architecture, and cost requirements.

From 100G to 1.6T: Expanding the Optical Interconnect Portfolio for AI Computing

GIGALIGHT has established a high-speed optical interconnect portfolio covering 100G, 200G, 400G, 800G, and 1.6T, while continuing to advance the integration of NPO silicon photonics and DWDM technologies.

At the First China Computing Expo, GIGALIGHT will showcase innovative products including the 1.6T NPO silicon photonics engine, 400G QSFP-DD DCO ZR+ coherent DWDM, and 400G QSFP-DD O-BAND non-coherent DWDM solutions. These products address both SCALE UP and SCALE ACROSS scenarios, providing AI computing clusters, data centers, and distributed computing networks with more flexible high-speed optical interconnect options.

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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——10.1-inch Industrial Touchscreen + Removable Battery: 800G/400G/200G PAM4 Portable BERT Puts Field Testing All on One Screen

August 10, 2026, Shenzhen, China. – GIGALIGHT, a leading provider of open optical networking components, today announced the launch of the touchscreen version of its 800G CHECKER. Building on the standard 800G CHECKER, the new model integrates a 10.1-inch industrial touchscreen tablet and a built-in removable battery module for fully integrated, mobile testing. It performs optical module, AOC, and DAC testing without an external computer, formally ushering data center optical module operations and maintenance (O&M) into the “visualized” era.

One Screen, Total Visibility: Freeing O&M from the “Laptop + Device” Burden

Traditional field testing of optical modules requires carrying both a BERT (bit error rate tester) and a laptop, with cumbersome cabling and time-consuming setup. The touchscreen 800G CHECKER combines the test unit and a 10.1-inch FHD (1920×1200) industrial touchscreen tablet into one device: 10-point capacitive touch, high-hardness tempered glass, an Intel Celeron N5100 processor, 8GB RAM, and 128GB storage, running Windows 11/10. Bit error rate testing, real-time DDM monitoring, EEPROM read/write, and FEC margin estimation are all accessible directly on screen with a single touch, presenting test data clearly and visually — significantly lowering the barrier to field O&M.

Dual Ports Covering Mainstream Form Factors, Comprehensive Testing Capability

The device features one QSFP-DD port and one OSFP/OSFP-RHS port (configurable via the GUI software; not used simultaneously), supporting 8×53.125GBd PAM4 (800G) and 8×26.5625GBd PAM4 (400G) bit error rate testing, and is compatible with mainstream form factors including QSFP112/QSFP56/QSFP28 and OSFP112/OSFP56. Core features include:

• CMIS V4.0 status detection and real-time DDM monitoring: real-time visibility into key parameters such as voltage, temperature, current, and optical power
• Full pattern support: PRBS Q7/9/10/11/13/15/20/23/31 and SSPRQ
• EEPROM read/write: flexible configuration for module compatibility
• FEC margin estimation: supports error-correction capability calculation for in-depth link quality assessment

Removable Battery + Shoulder Strap Design: No Blind Spots for Mobile Testing

The unit features a built-in removable lithium battery module rated at 142Wh, providing roughly 3 hours of actual operating runtime for the complete device (including the optical module under test), with support for an external 12V power adapter. The battery module has passed UN38.3 air transport safety certification and complies with GB 40165-2021; at 142Wh it falls within the 100–160Wh range and can be carried once declared and approved by the airline. Weighing only about 5kg, the complete unit comes with a shoulder strap and strap buckle rings, letting O&M personnel move easily between racks and workstations.

Industrial-Grade Reliability for Harsh Field Conditions

The touchscreen tablet has passed IP65 dust/water resistance certification, MIL-STD-810G military-grade certification, and a 1.22-meter drop test, and carries ATEX Zone 2/22 explosion-proof certification. The complete unit features an aluminum alloy housing, with the tablet embedded and physically isolated from the internal compartment, plus an optimized dual-fan airflow design for stable long-term operation. The device complies with CE, FCC, and RoHS certifications.

Typical Application Scenarios

Ordering Information

The touchscreen 800G CHECKER is now available for order, offered in two port configurations — 800G QSFP-DD+OSFP and 800G QSFP-DD+OSFP-RHS — both including the touchscreen tablet and built-in battery module.

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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With the rapid growth of AI computing infrastructure, 1.6T ultra-high-speed optical modules have entered large-scale commercial deployment, gradually replacing 800G modules and becoming the core hardware for high-speed interconnects in hyperscale data centers.

Compared with previous high-speed optical modules, 1.6T products double the transmission bandwidth and significantly increase throughput. However, these ultra-high data rates also introduce new challenges in signal integrity and stability.

To ensure the long-term reliability of AI computing networks, optical module testing standards have been significantly upgraded. In addition to conventional TX Eye Diagram and TDECQ measurements, Overshoot and Undershoot tests have been introduced as essential verification items. These new tests address transient waveform distortions that were previously difficult to detect and have become mandatory during 1.6T optical module production testing.

I. Why Does 1.6T Require New Dedicated Tests?

For previous-generation 400G and 800G optical modules, signal quality could be adequately evaluated using Eye Diagram masks and TDECQ measurements alone, without dedicated Overshoot or Undershoot testing.

The reason is straightforward: lower-speed electrical signals transition more gradually, making transient waveform abnormalities extremely rare and having little impact on system performance.

The transition to 1.6T transmission fundamentally changes this situation.

According to the IEEE 802.3dj specification, 1.6T optical modules employ 112 Gbaud PAM4 modulation, delivering 224 Gb/s per lane. Eight electrical lanes are aggregated to achieve an overall bandwidth of 1.6 Tb/s, with a Unit Interval (UI) of only 8.92 ps.

Such an extremely narrow timing window and ultra-fast signal transitions mean that even slight hardware imperfections or parameter deviations can cause waveform distortion.

Traditional testing methods mainly evaluate steady-state signal quality and therefore have several limitations:

• Limited measurement scope: Only steady-state signal characteristics at sampling points are measured, making transient waveform distortions invisible.

• Incomplete risk coverage: Overall signal degradation is evaluated, while transient voltage spikes that may damage chips or optical components are overlooked.

• Insufficient stress evaluation: Signal degradation under extreme operating conditions, such as high/low temperatures or heavy workloads, may remain undetected.

• Limited long-term reliability assessment: Existing tests identify immediate bit errors but provide little insight into long-term aging and reliability.

II. Understanding Overshoot and Undershoot

Overshoot and Undershoot are the most common transient waveform abnormalities in 1.6T high-speed transmission. They can be understood as signal “overcorrection” and “undercorrection” during voltage transitions.

Overshoot: During a rising edge, the signal temporarily exceeds its intended high voltage level, producing an excessive positive voltage spike.

Undershoot: During a falling edge, the signal temporarily drops below its intended low voltage level, creating an excessive negative voltage dip.

In practical 1.6T applications, these waveform anomalies are mainly caused by four factors:

• Impedance discontinuities: PCB traces, vias, and via stubs generate high-frequency reflections.

• Connector mismatch: Contact interfaces introduce impedance discontinuities and ringing effects.

• Over-aggressive equalization: Excessive pre-emphasis or equalization sharpens signal edges and produces overshoot.

• High-frequency interference: Power supply noise and crosstalk contribute to transient signal distortion.

III. Core Benefits of the New Tests

Adding Overshoot and Undershoot measurements is not merely expanding the test flow—it represents a fundamental enhancement to the 1.6T signal integrity verification methodology by extending testing from static measurements to comprehensive static + dynamic analysis.

The key benefits include:

• Eliminating testing blind spots by detecting transient waveform distortion that conventional measurements cannot capture.

• Protecting hardware components by preventing excessive voltage spikes from accelerating device aging or damaging optical and electrical ICs.

• Improving transmission stability through more accurate signal levels, resulting in lower BER and packet loss.

• Enhancing product quality by exposing potential failures under stress patterns before mass production.

IV. Industry Standards and Practical Significance

Industry specifications such as IEEE 802.3dj now recognize Overshoot and Undershoot measurements as mandatory verification items for 1.6T optical modules.

The general industry requirement specifies that both Overshoot and Undershoot should remain below 22%. However, leading AI infrastructure providers and hyperscale data centers often enforce stricter internal limits of 10%–15% to maximize link reliability.

These tests complement each other effectively. Eye Diagram and TDECQ evaluate average transmission quality, focusing on inter-symbol interference (ISI), random jitter, and noise. Overshoot and Undershoot measurements evaluate dynamic signal behavior, ensuring long-term hardware reliability.

Overall, the introduction of Overshoot and Undershoot testing is a natural evolution of optical module qualification for ultra-high-speed AI networks.

By comprehensively identifying waveform abnormalities and optimizing hardware design, parameter tuning, and operating conditions, these tests provide a stronger hardware foundation for the high-speed, low-power, and highly reliable operation of AI computing clusters and hyperscale data centers.

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July 7, 2026, Shenzhen, China. – GIGALIGHT today announced that it has been granted two new patents by the China National Intellectual Property Administration (CNIPA).

Patent 1: Optical Path Design for Optical Components Based on a Hybrid DSP and Semi-Linear Direct-Drive Optical Module

Completely different from the conventional design approach for high-speed 800G/1.6T optical modules, this patented technology serves as the core engine and the “heart” of GIGALIGHT’s Hybrid optical module architecture. The innovative optical path design enables the full functionality and complete implementation of the Hybrid optical module.

In general, LRO optical modules share a similar design philosophy with standard FRO optical modules. In contrast, the Hybrid architecture adopts a fundamentally different component layout and signal integrity design compared with FRO.

Like LRO, Hybrid is also a semi-DSP architecture for AI optical interconnects. In an LRO module, the transmitter incorporates a DSP while the receiver is DSP-free. The Hybrid architecture introduces a new framework in which either the transmit or receive path of a single optical module consists of 50% DSP-enabled channels and 50% DSP-free channels. The Hybrid architecture further supports heterogeneous breakout interconnect models for 2×400G and 2×800G optical modules. More importantly, GIGALIGHT views Hybrid as a system-level collaborative compensation architecture that enhances overall link robustness, rather than simply an evolution of LRO technology.

Patent 2: An External OSFP Optical Engine Compatible with NPO/CPO Architectures

ELSFP is currently the industry-standard form factor for external optical engines. This patented external optical engine adopts an OSFP package and introduces an alternative fiber routing method compared with ELSFP. The key advantage is that it enables system architectures with mixed pluggable port configurations, providing greater flexibility for network deployment and system design.

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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June 24, 2026 Shenzhen, China. – The International Conference for High Performance Computing, Networking, Storage and Analysis (ISC High Performance 2026) is taking place from June 23 to 25, 2026, at the Congress Center Hamburg, Germany. ISC High Performance 2026.

GIGALIGHT is exhibiting at the event with its latest 400G/800G AI data center interconnect solutions and immersion liquid cooling solutions. Visitors and global partners are warmly invited to visit Booth G02 for discussions and exchanges.

Featured Solutions :

400G & 800G AI & DC Copper Interconnect Solutions

• 800G OSFP / QSFP-DD PCC / ACC
• 800G OSFP to 2×400G QSFP112 / OSFP-RHS PCC/ACC
• 400G QSFP112 / OSFP-RHS PCC / ACC
• 800G OSFP HYBRID ACC+

400G & 800G AI & DC Optical Interconnect Solutions

• 800G OSFP / QSFP-DD VR8 AOC
• 800G OSFP VR8 to 2×400G QSFP112 / OSFP-RHS VR4 AOC
• 400G QSFP112 / OSFP-RHS VR4 AOC
• 800G QSFP HYBRID VR8 AOC

Immersion Liquid Cooling Solutions

• 800G / 400G / 200G / 100G / 25G Immersion Liquid Cooling Optical Transceivers
• SFP / QSFP / OSFP / QSFP-DD Immersion Liquid Cooling Extenders

Exhibition Highlights

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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June 23, 2026, Shenzhen, China. – GIGALIGHT recently announced the release of its white paper dedicated to Networking Technologies for Tool Intelligence and National Computing Networks. This white paper presents GIGALIGHT’s forward-looking technical positioning and industry outlook, serving as an internal guideline for the company’s differentiated product and technology R&D. Most products and technologies covered in the document have obtained patent authorizations from the National Intellectual Property Administration of China.

The outline of GIGALIGHT’s White Paper on Networking Technologies for Tool Intelligence and National Computing Networks is listed below:

I.Building Low-Latency and Low-Power Data Center Interconnect Networks with NRZ Modulation and Half-DSP Technologies
1.NRZ Modulation: Mature and Reliable for Ultra-Low Latency Performance
2.Half-DSP Modulation: LPO and Hybrid Optical Architectures

II.O-Band Non-Coherent DWDM as a Complement to Coherent Communication for Medium-Reach DCI

III.Three Flexible 1.6T Optical Interconnect Architectures for AI and Data Center Applications
1.Standard 1.6T Pluggable Optical Transceivers
2.External Light Source 1.6T Pluggable Optical Module
3.External Light Source 1.6T (16×100G) NPO Solution Near-Package Optics (NPO)

IV.Ultra-Low-Latency All-Optical Switching at Key Network Nodes Using AWGR-Based Architectures
1.Arrayed Waveguide Grating Router (AWGR) Technology
2.AI Cluster Architecture with AWGR + EDFA
3.AI Cluster Architecture with AWGR + SOA

Full text can be accessed via GIGALIGHT’s official website . Comments and suggestions from industry peers are highly welcome.

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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Computing power is a tool rather than intelligence. Alternatively, we ought to redefine a new type of tool intelligence. Aristotle’s Organon was not composed for everyday utensils. It establishes definitions of categories and logic. Why are categories and logic vital to all human undertakings? Because categories and logic constitute reflection upon thought itself. Adopting a tool-oriented mindset allows us to navigate toward sound scientific and philosophical trajectories.

The national computing power grid demands clear technical insights. Such insights must support upgradability and cross-technology compatibility. To prevent sound computing infrastructure from quickly becoming obsolete amid technological iterations, we must endow such infrastructure with inherent advancement. This advancement belongs to the unified, indivisible category. If we merely follow conventional, non-innovative development paths, the computing power grid will evolve into a consumptive, bloated architecture. Such a framework cannot guide us toward historically rigorous modes of thinking and risks stagnating subsequent development work. Since we define the computing power grid as embodying a degree of tool intelligence, we must operate and unleash this intelligence at minimal cost.

When a person lacks sufficient rest, their mind grows sluggish and briefly stalls or loses vitality. By analogy, the computing power grid resembles the human brain: it must adopt a lightweight daily architecture built for low latency and low-cost innovation, while boasting inherent competitive edges over networking systems deployed overseas.

I. Building Low-Latency and Low-Power Data Center Interconnect Networks with NRZ Modulation and Half-DSP Technologies

Within AI computing data center networks, NRZ (Non-Return-to-Zero) modulation and “Half-DSP” / linear-drive solutions, including LPO (Linear Pluggable Optics) and Hybrid architectures, have become important technology approaches for achieving both low latency and low power consumption.

These two technology paths are designed for different data rates and transmission distance scenarios. The core objective is to meet the requirements of high-speed interconnects while addressing the high power consumption and latency challenges associated with traditional full-DSP optical modules.

1. NRZ Modulati2. “Half-DSP” Modulation Solutions: LPO and Hybrid Technologiese, Reliable, and Optimized for Ultra-Low Latency

NRZ is a traditional binary modulation technology where each symbol carries one bit of information. In short-distance interconnect applications, its simple physical-layer characteristics make it a preferred solution for latency-sensitive networks.

• Application Scenarios

NRZ is mainly used in interconnect scenarios with single-channel speeds ≤200Gbps.

With continued technology evolution, some high-performance SerDes solutions are exploring NRZ-based optimization approaches for higher-speed applications. However, mainstream high-speed optical interconnects at 400G/800G and beyond have transitioned to PAM4 modulation.

• Key Advantages

Ultra-Low Latency
NRZ does not require complex digital signal processing (DSP) for signal equalization and error correction. The electrical-to-optical conversion process introduces almost no additional processing latency.

Low Power Consumption
With a simpler circuit architecture and without the high power overhead of DSP chips, NRZ-based optical modules typically maintain low power consumption levels, generally within several watts.

High Signal-to-Noise Ratio Tolerance
In optical fiber transmission, channel loss is relatively low. The two-level NRZ signal provides strong resistance to interference and maintains good signal integrity.

• Limitations

NRZ has relatively low spectral efficiency and cannot efficiently support high-speed transmission beyond 50Gbps per wavelength.
Therefore, in mainstream 400G/800G and higher-speed data center and AI computing interconnect architectures, NRZ is gradually being replaced by PAM4 modulation.

• GIGALIGHT’s 200G QSFP-DD S8/PSM8 parallel optical module represents a milestone product in this field.

2. “Half-DSP” Modulation Solutions: LPO and Hybrid Technologies

“Half-DSP” is not a formal industry standard term. It generally refers to reduced-DSP or DSP-free optical architectures, including:

LPO (Linear Pluggable Optics)
Hybrid / LRO (Linear Receive Only)

These solutions aim to maintain sufficient signal integrity while significantly reducing the power consumption and latency associated with traditional full-DSP optical modules.

LPO (Linear Pluggable Optics)

The LPO architecture completely removes the DSP chip from the optical module and retains only the linear driver and TIA (Transimpedance Amplifier).Signal processing and equalization are mainly handled by the advanced equalization capability of the switch-side ASIC.

Hybrid (Half Retimed & Half Linear) / LRO (Linear Receive Only)

Hybrid solutions typically retain partial linear-drive functionality at the transmitter or receiver side, or utilize simplified DSP logic in specific signal paths to achieve a balance between performance and power efficiency.

• Key Characteristics

Balanced Power Efficiency and Performance
Compared with LPO, Hybrid solutions can provide improved signal integrity for longer transmission distances (such as 100m–2km) while still achieving approximately 20%–30% power savings compared with full-DSP solutions.

Latency Optimization
Although some signal processing capability is retained, simplified algorithms or reduced DSP functions enable significant latency reduction.

• Application Scenarios

Hybrid and LRO solutions are suitable for 100m–2km short-to-medium distance interconnect applications, where transmission distance requirements remain important while power efficiency is highly valued.

• Core Technology Comparison

• GIGALIGHT’s Half-DSP / Hybrid optical modules and active optical cable (AOC) product portfolio represent engineering innovations in this field, providing practical solutions for large-scale network deployment with enhanced feasibility compared with traditional LPO/LRO approaches.

Representative products include:

HYBRID Single-Mode Optical Modules

HYBRID Multimode and Single-Mode AOC

HYBRID Copper Cable Solutions

II. O-BAND Non-Coherent DWDM as an Efficient Complement to Coherent Communication for Low-Latency and Cost-Effective Medium-Distance DCI

With the rapid growth of AI computing clusters and distributed data centers, Data Center Interconnect (DCI) networks are facing increasing demands for 400G/800G/1.6T high-speed optical interconnect solutions.

Although traditional coherent communication technologies provide excellent long-distance transmission capabilities, their complex DSP architecture, high power consumption, higher cost, and increased transmission latency have created efficiency and cost challenges for short- and medium-distance DCI applications within 30km.

To address this challenge, GIGALIGHT has introduced an O-BAND (1310nm window) non-coherent DWDM product portfolio.

By leveraging the natural zero-dispersion characteristics of the O-BAND window, this architecture eliminates the need for DCM (Dispersion Compensation Module) and enables an efficient transmission solution optimized for medium-distance data center interconnect applications.

Compared with traditional C-BAND coherent solutions, O-BAND non-coherent DWDM provides the following key advantages:

• Low Latency: By eliminating complex DSP-based dispersion compensation processing, the solution significantly reduces link transmission latency, making it highly suitable for latency-sensitive applications such as AI training and Real-time computing resource scheduling .

• Low Power Consumption: By adopting Silicon Photonics integration technology and PAM4 modulation architecture, the overall power consumption is significantly lower than traditional coherent optical modules.

• Cost Efficiency: The architecture eliminates the need for expensive coherent components, DCM modules, and complex optical line system designs, significantly reducing: CAPEX, Network deployment cost and Operation and maintenance expenses.

• High-Density Deployment: The solution supports high-density optical module form factors including QSFP-DD and OSFP,meeting the requirements of next-generation large-scale data center deployments.

• Open and Flexible Architecture: The solution supports open optical networking architectures and is compatible with white-box switches , open optical line systems and Improving overall network flexibility and deployment efficiency.

From 100G to 800G and further toward 1.6T, GIGALIGHT has established one of the industry’s most complete O-BAND DWDM pluggable product portfolios, covering different generations and capacity requirements for data center interconnect networks.

Product Portfolio:

1. 100G QSFP28 DWDM1

• Single wavelength 100G transmission
• Simplified deployment and operation
• System supports up to 16-channel wavelength transmission

2. 200G/400G QSFP-DD DWDM4

• 4-wavelength aggregation
• 50G/100G per wavelength
• System supports up to 16-channel wavelength transmission

3. 800G OSFP/QSFP-DD 2×PSM DWDM4 (O-BAND)

• Single wavelength 100G PAM4
• System supports up to 16-channel wavelength transmission

4. 1.6T OSFP224-EL 2×PSM DWDM4 (O-BAND)

• Single wavelength 200G PAM4
• External light source architecture
• System supports up to 16-channel wavelength transmission

O-BAND DCI Interconnect Application Scenario

Transmission Distance: 2km–30km

III. Three Flexible Solutions for 1.6T AI & Data Center Interconnect

With the explosive growth of AI computing requirements, data center interconnect bandwidth is rapidly evolving from 400G/800G toward 1.6T.

To meet deployment requirements across different application scenarios, the industry is developing three major technology approaches for 1.6T optical interconnects. Each solution provides different advantages and is optimized for different requirements in terms of cost structure ,power budget and deployment scalability.

1. Standard 1.6T Pluggable Optical Transceiver

Standard 1.6T OSFP224 Optical Module

The 1.6T OSFP224 optical module is a next-generation high-speed optical transceiver featuring:

• Total bandwidth of 1.6Tbps
• OSFP224 form factor
• Designed to support AI clusters and high-performance computing bandwidth requirements

It represents one of the mainstream solutions for next-generation AI networking deployments.

Core Parameters and Definition

Data Rate and Form Factor

Total Data Rate : 1.6Tbps total bandwidth is achieved through 8 × 200G PAM4 electrical channels. After protocol overhead, the effective payload reaches approximately 1.6Tbps.

OSFP224 Form Factor：OSFP224 is an evolution of the traditional OSFP form factor. It features:

• 224 electrical contacts
• Support for 16 electrical lanes
• Higher port density
• Enhanced thermal capability

It is designed for high-density AI switch deployments.

Standard 1.6T Pluggable Module Solutions

2.External Light Source 1.6T Pluggable Optical Module (External Light Source Pluggable, ELS-Pluggable)

This architecture separates the laser source from the 1.6T OSFP224 optical module. A centralized:

• Rack-level external light source
• Board-level external light source
• Co-packaged light source

provides optical power to multiple pluggable modules through fiber coupling.

The optical module itself only retains modulators and photodetectors and required electrical processing components. This architecture significantly reduces thermal load at the individual module level.

As one of the pioneers proposing the External Light Source 1.6T Pluggable Optical Module architecture, GIGALIGHT provides the following solutions:

3. External Light Source 1.6T (16×100G) NPO Solution Near-Package Optics (NPO)

The NPO architecture represents a transition technology between pluggable optics and Co-Packaged Optics (CPO). In the NPO architecture, the optical engine is no longer integrated inside the switch ASIC package.

Instead, it is installed immediately outside the package.

Combined with an external light source, NPO enables ultra-short-distance high-speed interconnects through Silicon Photonics or Polymer waveguide technologies.

The 1.6T NPO solution is typically deeply integrated with Silicon Photonics platforms to achieve extremely low electrical-to-optical transmission loss.

It should be noted that practical NPO optical engine architectures generally need to be based on:

16×100G physical architecture
32×100G physical architecture

This represents the key differentiation point compared with 1.6T pluggable optical modules.

Although the industry is exploring 3.2T NPO and 6.4T NPO

Architectures based on 224G SerDes technology, related standards have not yet been finalized.

Comparison of Three 1.6T Solutions

Deployment Roadmap

The three solutions are not mutually exclusive alternatives.

Instead, they represent a layered deployment strategy targeting different technology maturity stages and application scenarios.

Near Term (2024–2026): Standard pluggable optical modules will remain the mainstream solution, supporting smooth upgrades for most data center deployments.

Mid Term (2027+): External light source pluggable architectures are expected to achieve rapid adoption in large-scale AI clusters by balancing deployment flexibility and power optimization

Long Term (2027+): With the maturity of Silicon Photonics technology and standardization progress, NPO solutions are expected to become a major architecture for AI supercomputing interconnects, providing the foundation for future 3.2T and 6.4T network evolution.

IV. Enabling Ultra-Low Latency All-Optical Switching at Critical Network Nodes with AWGR + EDFA / AWGR + SOA Architectures

1. AWGR (Arrayed Waveguide Grating Router)

AWGR is a passive wavelength routing engine that utilizes its cyclic wavelength routing characteristics to deterministically map different optical wavelengths within a WDM signal to corresponding output ports.

Unlike traditional electrical switching architectures, AWGR does not require lookup tables, packet scheduling and optical buffering.

Therefore, it completely eliminates the traditional optical-electrical-optical (O-E-O) conversion process in electrical switching systems.

The optical signal remains entirely in the optical domain throughout the transmission process.

A single-stage optical switching operation introduces only nanosecond-level latency, which is:

• 2–3 orders of magnitude lower than traditional OEO architectures
• Highly deterministic with extremely low latency jitter

This capability makes AWGR-based optical switching highly suitable for:

• AI computing clusters
• Low-latency computing networks
• High-performance computing scheduling applications

2. AI Computing Cluster AWGR + EDFA Optical Switching Topology

1) Architecture Overview

This architecture is mainly designed for data center inter-rack optical switching and cross-campus long-distance all-optical switching hubs.The topology adopts a three-level flattened architecture:

Compute Access Layer → Core Wavelength Switching Layer → Optical Amplification Output Layer

Access Layer

• Each AI computing node / GPU server outputs optical signals through:
• 100G PSM DWDM4 (C-BAND) optical modules
• Each optical port directly carries:
• Four fixed C-band wavelengths
• The optical signals are then aggregated through a:
• DWDM multiplexer (MUX)

Core Switching Layer

• After wavelength multiplexing, signals are transmitted into an:
• N×N AWGR wavelength router
• The AWGR performs optical routing switching based on wavelength assignment.
• The switching process is completed entirely in the optical domain.

Optical Compensation Output Layer

• After AWGR switching, the system experiences approximately:
• 8dB inherent insertion loss
• An EDFA (Erbium-Doped Fiber Amplifier) is used to compensate for this optical loss.
• The amplified signal is then transmitted to:
• Next-stage switching nodes
• Target computing clusters
• Supporting transmission distances at the:
• 10km level

2) Topology Characteristics

Key advantages include:

• No multi-stage O-E-O conversion
• Core switching latency below 1μs
• Simplified network architecture
• Suitable for large-scale computing hubs with relatively stable network topology

Technical Parameter Comparison

3. AI Computing Cluster AWGR + SOA Optical Switching Topology

This architecture is mainly designed for:

• In-rack optical switching
• Same data center high-density optical switching hubs
• Ultra-low latency AI cluster interconnects

The topology adopts a compact architecture combining:Active Scheduling + All-Optical Switching + Integrated Optical Amplification

Wavelength Scheduling Layer

Each computing node connects to:

• O-BAND DWDM optical components
• O-BAND multi-wavelength tunable optical engines

The scheduling controller dynamically adjusts output wavelengths according to GPU communication requirements, including Gradient synchronization and Parameter broadcasting.

GIGALIGHT provides O-BAND DWDM parallel optical modules with different baud rates to support medium-distance AI computing interconnect applications.

Core Optical Switching Layer

The dynamically scheduled wavelength signals are transmitted into:

AWGR wavelength routers

The AWGR performs:

• Wavelength-based optical routing
• Nanosecond-level optical path switching

Integrated Optical Amplification Layer

The architecture uses:

SOA (Semiconductor Optical Amplifier) for amplification of weak optical signals after switching.

Compared with EDFA, SOA provides:

• Smaller form factor
• Better integration capability
• Suitability for high-density rack deployment

SOA can also assist with:

• Wavelength conversion
• Enhanced scheduling flexibility

Topology Characteristics

The complete switching process latency can be reduced to:

• Below 100 nanoseconds
• The power consumption of a single optical switching chip is approximately:
• 1/10 of a comparable electrical switching ASIC

This architecture is highly suitable for:

• Large-scale AI training clusters
• Thousands of GPU interconnect environments
• Low-latency east-west GPU communication

The network architecture diagram

Key Node Selection Recommendations

Conclusion

The core essence of a computing power network resides in its capability to invoke tools. A pure computing power network, an expensive piece of infrastructure, would be utterly meaningless without a society-wide foundation of lifelong learning.

From any perspective of commercial development, blind dependence on large computing models will clash with knowledge undertakings constructed through language. Commercial organizations may only conduct innovative thinking based on computing power networks; they must not regard computing power itself as a competitive advantage.

Computing power networks should function as networks that boost the intellectual capacity of all citizens. Otherwise, trillions of capital invested will fail to deliver any positive outcomes.

Just as traditional telecommunication pipelines were built to connect information, computing power networks exist to connect humans with instrumental intelligence.

Only when we precisely define the core value and positioning of computing power networks can this network become a digital infrastructure worthy of massive national investment.

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June 22, 2026, Shenzhen, China. – GIGALIGHT today officially announced the relocation of its Technology Center and Manufacturing Facility to a brand-new office location.

Dear Customers, Suppliers, and Business Partners,

Greetings!

We sincerely appreciate your long-term trust and strong support for GIGALIGHT. As our business continues to expand, the original office and production space can no longer meet our development needs. Effective June 22, 2026, our Technology Center and Manufacturing Facility have officially relocated to the following new address:

Floors 10–11, Building A, Longbang Kexing Science Park, Guangming District, Shenzhen, Guangdong Province

We look forward to meeting and communicating with you in person at our new office location.

Tel: +86-755-26734300

Email: [sales@gigalight.com]

About GIGALIGHT

As an open optical networking explorer, GIGALIGHT integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes III-V optical modules, silicon photonics modules and silicon-based NPO/CPO engines, liquid-cooled optical modules, passive optical components, Active Optical Cables (AOCs), Direct Attach Cables (DACs), coherent optical communication modules, OPEN DCI BOX subsystems based on coherent and O-band DWDM optical modules, and UHD SDI video optical transceivers. GIGALIGHT focuses on applications including AI data centers, 5G transport networks, metropolitan WDM transmission, and ultra-HD broadcast and video, positioning itself as an innovative designer of high-speed optical interconnect hardware solutions.

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As AI large model computing infrastructure accelerates across the industry, with 800G achieving large-scale deployment and 1.6T entering mass commercialization, the power consumption of high-speed optical modules continues to surpass the physical limits of air-cooling. Liquid-cooled optical modules have been upgraded from customized optional solutions to standard products for high-end AI data centers, becoming a critical necessity in computing network construction. Leveraging the superior heat transfer coefficient of liquid, these modules address key challenges such as frequency throttling and rising bit error rates caused by extreme heat in ultra-high-bandwidth devices.

I. Definition and Mainstream Technical Solutions of Liquid-Cooled Optical Modules

Liquid-cooled optical modules are specialized optical interconnect devices developed for high-density AI computing clusters. They use coolant to directly dissipate heat from core components such as DSPs and EML lasers, achieving heat transfer efficiency more than three times that of conventional air cooling, enabling reliable continuous operation of high-power devices. Based on the overall thermal management architecture of data centers, the industry has formed three mainstream technical approaches.

Approach 1: Cold Plate Contact Liquid Cooling

This is also the mainstream solution for 800G/1.6T pluggable modules. A fixed copper cold plate is integrated into the switch cage, and after the optical module is inserted, its housing makes tight contact with the cold plate. Internal circulating water cooling removes the heat. This approach has a low retrofit difficulty, is compatible with existing OSFP and QSFP-DD form factors, and suits the upgrade needs of existing data centers transitioning from air cooling to liquid cooling.

Approach 2: Module-Embedded Microchannel Liquid Cooling

Microchannels are pre-embedded inside the optical module housing, paired with quick-connect fluid couplings, allowing coolant to directly contact the heat-generating chips. The thermal dissipation limit per module exceeds 80W, making it compatible with XPO ultra-high-density optical modules. However, the sealing and leak-prevention manufacturing requirements are relatively demanding.

Approach 3: Full Immersion Liquid Cooling

The entire optical module is submerged in fluorinated liquid, enabling uniform heat dissipation across all surfaces. It is suited for ultra-high-power single-rack AI clusters exceeding 60 kW. Small-scale pilot deployments have been conducted domestically, but the approach requires full rack retrofitting, resulting in high upfront infrastructure costs.

Compared to traditional air-cooled optical modules, liquid-cooled products significantly reduce operating temperatures, greatly lowering component aging and link bit error rates caused by excessive heat. They also help data centers achieve a PUE below 1.15, aligning with domestic energy consumption standards for new computing centers. In terms of product specifications, current liquid cooling retrofits prioritize 1.6T and above products, where heat flux density exceeds 100 W/cm² and air cooling is insufficient. The optimized LPO architecture brings 800G power consumption below 10W, allowing air cooling to remain viable in some mid-to-low-end scenarios, with liquid cooling reserved for high-end training clusters.

II. Current Industry Deployment Status

Global AI computing infrastructure investment continues to intensify, with overseas cloud providers and domestic AI data centers maintaining elevated capital expenditures. The explosive demand for high-speed, high-power optical modules is driving liquid cooling solutions from pilot deployments to large-scale commercial adoption.

On the supply side, a domestic-manufacturer-led industry structure has taken shape, with leading enterprises outpacing global peers in technology iteration and mass production. Innolight holds the top position in the global optical module industry, with over 40% global market share in 800G and 50%–70% in 1.6T. Its liquid-cooled 1.6T optical modules have achieved stable volume delivery, with mature cold plate integration manufacturing processes and deep compatibility with overseas high-end computing cluster requirements.

The industry standards ecosystem is also maturing, effectively resolving early challenges of non-standardization and poor compatibility. China’s ODCC has officially released the White Paper on Key Liquid Cooling Technologies for 800G/1.6T Optical Modules, unifying cold plate dimensions, contact methods, fluid interfaces, and sealing specifications for mainstream pluggable optical modules, providing a standards basis for retrofitting existing data centers and scaling up new ones. Meanwhile, leading industry players are jointly advancing frontier standards such as XPO ultra-high-density packaging and next-generation liquid cooling interfaces to accommodate 3.2T and above ultra-high-speed liquid-cooled optical modules, driving the industry’s upgrade from volume production toward standardization, normalization, and high reliability.

III. Existing Industry Development Challenges

Despite the positive industry momentum, the widespread adoption of liquid-cooled optical modules remains constrained by several bottlenecks.

Sealing and leakage reliability: The plug-in connectors for embedded microchannel liquid cooling modules require high precision, and the risk of leakage under long-term thermal cycling is difficult to fully eliminate. Immersion solutions also require all module components to be modified for resistance to fluorinated liquid immersion, increasing material costs by more than 20%.

High supply chain costs: Domestic production rates for thermal components such as copper cold plates, quick-connect fluid couplings, and specialized sealants remain insufficient, with high-end accessories dependent on imports. Liquid-cooled optical modules carry a 25%–40% price premium over air-cooled equivalents at the same speed, limiting adoption rates among small and mid-sized computing centers.

Packaging compatibility conflicts: Traditional QSFP-DD and OSFP cage spaces are compact, leaving insufficient structural room after cold plate installation. The high cost of large-scale retrofitting of existing switches constrains the upgrade pace of legacy data centers.

IV. Core Future Industry Development Trends

Continuous product speed upgrades, with liquid cooling becoming standard for 3.2T: As single-channel 400G electro-optical devices are developed and commercialized, full-scale R&D of 3.2T optical modules has launched. Product power consumption will exceed 60W, at which point air cooling will be entirely replaced by liquid cooling.

Deep coupling of silicon photonics, CPO, and liquid cooling: After co-packaged optics (CPO) and silicon photonics technologies are integrated, local heat flux density multiplies, necessitating embedded microchannel liquid cooling. Within the next 2–3 years, liquid cooling designs are expected to be completed concurrently during the optical engine packaging stage, achieving native thermal optimization.

Accelerating domestic substitution with declining costs: Domestic enterprises in precision copper processing and sealing components are accelerating technology breakthroughs, gradually increasing the domestic production rate of cold plates, fluid couplings, and other components. By 2027, the price gap between liquid-cooled and air-cooled products is expected to narrow to within 10%, and the domestic liquid-cooled optical module market is projected to exceed 10 billion RMB. Additionally, low-power technologies such as LPO will give rise to lightweight semi-liquid-cooled solutions suited for mid-to-low-end data centers.

Gradual scaling of immersion liquid cooling: In the short term, cold plate contact cooling remains dominant. Over the medium to long term, full immersion liquid cooling will accelerate penetration owing to its superior thermal efficiency, shifting data centers from single-point liquid cooling to full-link liquid cooling. Driven by green computing policies, the liquid-cooled optical module industry is expected to enter a high-growth cycle lasting more than five years, with a compound annual growth rate exceeding 50%.

Conclusion

AI computing demand is reshaping the optical communications industry, and the transition of liquid-cooled optical modules from customized to standardized products has become a clear trend. In the short term, 800G/1.6T liquid-cooled products will continue to scale in volume. Over the medium to long term, silicon photonics, CPO, and advanced packaging technologies will drive liquid cooling to become standard across all 3.2T and higher speed products. As domestic substitution reduces costs, liquid-cooled optical modules are poised to become the universal form factor for data communications optical modules, with deep benefits from global computing infrastructure buildout.

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